The Image Sensor Overview Report provides the device identification and downstream part identification (if applicable). This analysis is used by clients for des more...
The Image Sensor Overview Report provides the device identification and downstream part identification (if applicable). This analysis is used by clients for design win tracking, to locate what image sensor is found in what camera for systems analysis.
NC81361A - Image Sensor Pixel Planar Analysis
IPR-1005-803-3
USD 3,500
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The Image Sensor Pixel Planar Analysis provides the layout of the pixel, pixel schematic, and related pixel horizontal dimensions. It is used by clients to unde more...
The Image Sensor Pixel Planar Analysis provides the layout of the pixel, pixel schematic, and related pixel horizontal dimensions. It is used by clients to understand the efficiency of the pixel design.
The Image Cross Sectional Analysis provides process details about the pixel design using 20 to 30 SEM and TEM images, with analysis that takes clients from the more...
The Image Cross Sectional Analysis provides process details about the pixel design using 20 to 30 SEM and TEM images, with analysis that takes clients from the lens to the pixel transistor gates. It is used by clients to understand the process technology used to fabricate the device.
NC81361A - Image Sensor Substrate Dopant Analysis
IPR-1005-803-5
USD 5,500
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The Image Sensor Substrate Dopant Analysis provides pixel bevel SCM analysis with pixel cross-sectional SCM analysis, SRP of the pixel substrate, and SRP and SC more...
The Image Sensor Substrate Dopant Analysis provides pixel bevel SCM analysis with pixel cross-sectional SCM analysis, SRP of the pixel substrate, and SRP and SCM of the peripheral substrate. It is used by clients to better understand the process technology that delivers the sensitivity of the pixel.
NC81361A - Image Sensor Periphery and Logic Process Review
IPR-1005-803-6
USD 7,000
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The Image Sensor Periphery and Logic Process Review provides a 50 – 70 page process summary of the general logic regions of the device. It is used by clients to more...
The Image Sensor Periphery and Logic Process Review provides a 50 – 70 page process summary of the general logic regions of the device. It is used by clients to benchmark the process technology of the standard logic regions of the device.
Nikon D3s 12.1 Mp full frame (36 x 24 mm) CMOS Image Sensor - Imager Process Review
IPR-1005-803
USD 15,000
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This Imager Process Review on the NC81361A from the Nikon D3s DSLR goes inside the process technology of this leading sensor technology. This report includes ca more...
This Imager Process Review on the NC81361A from the Nikon D3s DSLR goes inside the process technology of this leading sensor technology. This report includes camera teardown images, die photographs and die markings, as well as the dimensions of the major microstructural features. Scanning electron microscopy (SEM), and cross-sectional micrographs of the dielectric materials using a transmission electron microscope (TEM) are used for this analysis.
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